From Schematic to Manufactured Board

Meet Hardware

Schematic capture, PCB layout, SPICE, signal integrity for USB/PCIe/NVMe, RF for WiFi/Bluetooth, power electronics, and full battery engineering — all in one integrated electronic design platform.

Get Started Explore Disciplines 
* LM2596 Buck converter — 12V to 5V @ 3A
.include lm2596.lib
.param vin=12 vout=5

Vin     vin   0     {vin}
Xreg    vin   fb   sw  gnd en   LM2596
L1      sw    vout       33u
C_in    vin   0          100u
C_out   vout  0          220u
D1      0     sw         D_SCHOTTKY
R_load  vout  0          1.67  ; 3A

.tran  1u 5m
.probe V(vout) I(L1) efficiency

# Run the full bench from the CLI
$ hardware sim power/buck.sp --sweep load,tempC
# ✓ Vout = 5.02 V  (ripple: 38 mVpp)
# ✓ Efficiency = 92.4% @ 3A, 25°C
# ✓ No SOA violation on Q1, D1

Every Discipline, One Platform

From schematic capture through RF and battery engineering to Gerbers, Koder Hardware covers the full system-level design flow in a single project.

⚙

Schematic & PCB

Hierarchical schematic capture, interactive push-and-shove router, differential pair routing, length matching, and constraint-driven DRC up to 32 layers.

ERCdiff pairs3D view
⚖

SPICE & Mixed-Signal

Transient, AC, DC, Monte Carlo, and noise analysis. Verilog-A/AMS co-simulation for digital-analog blocks.

transientnoiseVerilog-A
◠

Signal Integrity

Channel analysis, eye diagrams, jitter budgets, and compliance for USB 2/3/4, PCIe Gen3–Gen6, NVMe, DDR4/DDR5, and Ethernet up to 100 Gbps.

USB4PCIe Gen6NVMe
📶

RF & Wireless

Antenna design, matching networks, and full RF chain simulation for WiFi (2.4G/5G/6G/7), Bluetooth / BLE, LoRa, Zigbee, UWB, and 5G.

WiFi 7BLE5G
⚡

Power Electronics

Buck, boost, buck-boost, flyback, forward, LLC resonant, LDOs, PFC, and protection circuits with efficiency maps and thermal derating.

buckLLCPFC
⏻

Battery Engineering

Li-ion (NMC, NCA, LFP, LCO), Li-polymer, NiMH, lead-acid, and solid-state modeling with aging, thermal behavior, and BMS design.

Li-ionBMSaging
🚨

Thermal & EMC

Board-level thermal analysis, radiated and conducted emission estimation, and pre-compliance testing reports.

thermalEMIEMC
📦

Manufacturing Output

Gerber, ODB++, BOM with live supplier pricing, pick-and-place files, and direct handoff to fabs like JLCPCB, PCBWay, OSH Park, and Eurocircuits.

GerberODB++BOM

How It Works

Walk the same project from schematic through sign-off to fab handoff — without switching tools.

Schematic Capture with Live ERC

Draw the schematic, pick parts from a library that's live-synced with Mouser, DigiKey, LCSC, and Octopart. ERC runs in the background as you type.

  • Hierarchical multi-sheet designs with typed ports
  • Symbol and footprint decoupling (KiCad 8+ style)
  • Live ERC: shorts, floating inputs, unconnected outputs
  • Cross-probing between schematic, PCB, and 3D view
# Project declaration — hardware.kdl
project "sensor-node" {
  target pcb = "4-layer FR4"
  stackup    = "JLCPCB JLC04161H-3313"

  sheet power {
    part U1 = lookup("TPS62840")
    part L1 = lookup("Murata LQH32PN", inductance: 4.7uH)
    net VIN -> U1.IN
    net VOUT = U1.SW + L1.1 -> "3.3V"
  }

  sheet wireless {
    part U2 = lookup("nRF52840")
    part ANT = lookup("Johanson 2450AT18")
    net RF = U2.ANT <-> ANT.FEED
  }

  constraint diff_pair USB_DP USB_DN {
    impedance = 90 ohm; length_match < 2 mil;
  }
}

Signal Integrity for USB 4, PCIe Gen6, NVMe

Import S-parameter models for chip packages (directly from Koder Silicon when available) and run channel analysis, eye diagrams, and compliance checking from one place.

  • IBIS-AMI SerDes modeling with CTLE and DFE
  • Eye diagrams and jitter budgets per lane
  • USB-IF and PCI-SIG compliance masks built in
  • Direct S-parameter import from Koder Silicon
# Run a signal-integrity sweep on the PCIe link
$ hardware si run pcie/gen6-x4.si \
    --channel "cpu_pkg -> via -> stripline -> connector" \
    --tx-ami cpu_tx.ibs \
    --rx-ami nvme_rx.ibs

Lane 0: eye height 112 mV, eye width 26 ps  [ PASS ]
Lane 1: eye height 108 mV, eye width 25 ps  [ PASS ]
Lane 2: eye height 110 mV, eye width 25 ps  [ PASS ]
Lane 3: eye height 114 mV, eye width 27 ps  [ PASS ]

PCI-SIG Gen6 compliance: PASS (all lanes within mask)
BER estimate (worst): 3.2e-13

Battery Packs & BMS Design

Model cells down to the electrochemistry, size the pack for your thermal envelope, and generate the BMS firmware reference design — all in the same project.

  • DFN and SPM electrochemical models
  • Equivalent-circuit models for real-time BMS
  • UN38.3 and IEC 62133 pre-compliance reports
  • Reference BMS code for TI, ADI, NXP, and Renesas
# Design a 4S2P Li-ion pack for a drone
battery pack("drone-4s2p") {
  cell    = lookup("Samsung INR21700-50S")
  layout  = series(4) * parallel(2)
  ambient = 25 degC
  profile = "drone-race-8min"
}

bms {
  frontend = lookup("TI BQ76942")
  balancing = passive(threshold: 10 mV)
  soc       = ekf(cell_ecm: ecm)
  protect   = ovp(4.25) + uvp(2.50) + ocp(40) + otp(60)
}

→ Pack capacity : 10.0 Ah (140 Wh)
→ Peak current  : 50 A (2.5C)
→ Cycle life    : 712 cycles to 80% SoH
→ UN38.3        : passed (T1–T8)
→ IEC 62133     : passed (all sections)

One Command to the Fab

Generate Gerbers, BOM, pick-and-place, and assembly drawings, then hand off directly to the fab of your choice.

  • Gerber X2, ODB++, IPC-2581 output
  • Live BOM pricing from Mouser, DigiKey, LCSC, Octopart
  • Direct submission to JLCPCB, PCBWay, OSH Park, Eurocircuits
  • Publish finished boards to Koder Robotics as catalog parts
# Build manufacturing output and submit to fab
$ hardware fab build --stackup jlc04161h
 → gerber    written  (12 files, 312 KB)
 → drill     written  (plated: 184, npth: 8)
 → bom       priced   (48 lines, $18.42/unit @100)
 → cpl       written  (top: 62, bot: 14)
 → assembly  drawings (build/assembly.pdf)

$ hardware fab submit --service jlcpcb --qty 100
 → uploaded  3.1 MB
 → quoted    $412.00 (7 days)
 → order id  JLC-2026-A8F3

Built for Production Boards

Everything your electronics project needs — engineered as one coherent platform.

⚙
Push-and-Shove Router

Interactive router with diff-pair length matching under 1 mil, neckdowns, and tear-drops.

💾
3D Viewer

Realistic 3D rendering with mechanical fit checking, enclosure integration, and STEP export.

🔍
Live ERC & DRC

Electrical and design-rule checks run in the background with results streaming to the editor.

📶
Antenna Designer

PCB antennas, chip antennas, and external antennas with MoM solver and S-parameter extraction.

☀
Thermal Simulation

Board-level thermal analysis with component power dissipation and convective cooling.

🔋
EMI / EMC Pre-compliance

Radiated and conducted emission estimation with pre-compliance testing reports.

🌐
Supplier Sync

Library synced with Mouser, DigiKey, LCSC, and Octopart. Real-time pricing, lifecycle, and alternate parts.

⚡
Wireless Power

Qi, AirFuel, and custom inductive/resonant charging design, including coil geometry optimization.

⏻
Cell Chemistry DB

Curated, calibrated library of Li-ion, Li-polymer, NiMH, lead-acid, and solid-state cells.

🛠
Multi-board Systems

Design systems with multiple interconnected PCBs, cable harnesses, and mechanical fixtures.

📊
Yield & Tolerance

Monte Carlo tolerance analysis and yield estimation at the system level.

📦
Direct Fab Submission

Submit orders to JLCPCB, PCBWay, OSH Park, and Eurocircuits from inside the project.

Architecture

Clean layered stack — every discipline shares the same project and storage.

Clients
Flutter Desktop · Web IDE · CLI (hardware) · LSP · gRPC
Project & Job Layer
Project Manager · Library Registry · Job Runner · Supplier Adapters
Design Tools
Schematic · PCB Layout · 3D Viewer · ERC · DRC · Mechanical
Simulation Kernels
SPICE · Thermal · Signal Integrity · RF / EM (MoM, FDTD) · EMC
Specialty Studios
Power Electronics · Battery & BMS · Antenna · High-Speed Channels
Manufacturing
Gerber / ODB++ / IPC-2581 · BOM · CPL · Fab Submission
Storage
Koder KDB (design DB) · S3 (artifacts) · LFS (3D models, waveforms)

How It Compares

Koder Hardware brings schematic, PCB, SPICE, SI, RF, power, and battery into one project.

Capability Koder Hardware KiCad Altium Designer Cadence Allegro Autodesk Eagle Siemens PADS
Schematic + PCB✓✓✓✓✓✓
Integrated SPICE✓ngspice✓—✓—
Signal Integrity (USB/PCIe/NVMe)✓—✓✓—✓
RF / WiFi / Bluetooth✓—PartialAdd-on—Partial
Power Electronics Studio✓—————
Battery & BMS Design✓—————
Live Supplier Sync✓Plugin✓—Partial—
3D View with STEP✓✓✓✓✓✓
Direct fab submission✓—————
Chip-to-board co-simulation✓——Partial—Partial
Unified project & storage✓—————

Ready to build real hardware?

One platform. Schematic to fab. Chip to battery.

Get Started for Free